Overview of WUS Printed Circuit Kunshan Co Ltd (HDGF)
The available data does not contain any recent corporate announcements, earnings releases, or market‑specific events that directly involve WUS Printed Circuit Kunshan Co Ltd (ticker HDGF, Shenzhen Stock Exchange: SZ002463). Consequently, there are no current news items to report for this company beyond the general fundamental information provided.
Key Fundamental Metrics (as of 2026‑07‑21)
| Metric | Value |
|---|---|
| Closing price | 114.23 CNY |
| 52‑week high | 158.20 CNY |
| 52‑week low | 49.12 CNY |
| Market capitalization | 219 820 048 384 CNY |
| Price‑earnings ratio | 55.37 |
| Sector | Information Technology |
| Industry | Electronic Equipment, Instruments & Components |
| Primary exchange | Shenzhen Stock Exchange |
| IPO date | 18 August 2010 |
Business Focus
- Production of double‑sided and multilayered circuit boards.
- Manufacture of connectors for electrical equipment.
- Operations are based in Kunshan, China.
Market Context
While the broader Shenzhen market experienced activity related to AI‑focused funds and semiconductor‑related stocks in July 2026, there is no indication from the provided sources that HDGF has been cited in any fund holdings, earnings releases, or sector‑specific news. The company’s recent trading metrics, such as the closing price and market cap, remain unchanged from the last available data snapshot.
Conclusion
Given the absence of recent news or developments concerning HDGF in the supplied information, no additional commentary or analysis can be generated beyond the fundamental snapshot above. If new disclosures or market events emerge, they would be incorporated in subsequent updates.
