Sai Micro Electronics’ Strategic Momentum in the Semiconductor Ecosystem

Sai Micro Electronics (股票代码 300456) has reinforced its position as a key player in China’s high‑performance electronic component sector through a series of targeted acquisitions, facility expansions, and technology road‑mapping initiatives announced in late November 2025.

1. Capital‑intensive acquisition of ChipDongLa

On 18 November the company disclosed that it would pay no more than 60 million CNY for a stake in ChipDongLa, a 2023‑established firm that specializes in both re‑manufacture and in‑house development of photolithography systems. The transaction values ChipDongLa at no more than 520 million CNY and is classified as an inter‑company transaction that does not constitute a major asset restructure. This move expands Sai Micro’s footprint in the semiconductor equipment supply chain, providing a critical enabler for in‑house advanced process development. By integrating a photolithography capability, the company is positioning itself to accelerate the production of next‑generation MEMS, silicon‑photonics, and MEMS‑OCS devices, thereby shortening the time‑to‑market for its high‑performance automotive and communications components.

2. Consolidation of the Beijing operation

In a complementary development, Sai Micro’s wholly‑owned subsidiary, Beijing Zhongke Sai Micro Electronics Technology Co., Ltd., has relocated its registered address to Haidian District, Beijing, at 25 Hua‑Yuan‑Bei‑Road, Suite 1‑208. The change, executed for operational efficiency, does not alter the company’s legal or tax status. The move underscores the firm’s intent to deepen its presence in China’s capital, where a concentration of design houses, automotive OEMs, and advanced manufacturing facilities is rapidly expanding.

3. Silicon‑photonic chip R&D and wafer‑level manufacturing

During the investor‑interaction session on 18 November, Sai Micro confirmed that its domestic production line now supports silicon‑photonic (Si‑Photonics) process development and small‑batch wafer fabrication for optical interconnect, computing, and network applications. MEMS‑OCS (Micro‑electro‑mechanical systems – optical‑switching‑components) prototypes have entered small‑batch production, with technical specifications steadily improving. The company plans a phased ramp‑up of wafer‑level mass production in response to market demand, with an overseas line already demonstrating commercial‑grade yield metrics.

4. Expanding the “Pure‑Foundry” service offering

Sai Micro has announced the acquisition of the design‑software provider, Zhan Cheng Technology, to bolster its EDA (Electronic Design Automation) capabilities. This strategic purchase aligns with the company’s “Pure‑Foundry” model, enabling it to provide end‑to‑end service—from MEMS‑chip fabrication to physical design and packaging—without compromising proprietary process control. By integrating Zhan Cheng’s tooling, Sai Micro will accelerate the delivery of custom MEMS solutions for automotive sensors, power modules, and other high‑reliability components.

5. Positioning amid geopolitical uncertainties

A separate investor query highlighted concerns regarding potential geopolitical risks associated with the company’s prior stake in the Swedish firm Silex. Sai Micro’s management clarified that the divestiture of its controlling interest was a deliberate risk‑mitigation measure, ensuring continued operational stability amid tightening global supply‑chain constraints. The decision to retain a non‑controlling position allows the firm to benefit from the Swedish firm’s expertise while safeguarding its own strategic autonomy.

6. Outlook

With a market capitalization of 19.9 billion CNY and a P/E ratio of 13.05, Sai Micro’s recent moves signal a clear intent to deepen its technological stack and broaden its customer base in the automotive and optical communications markets. The acquisition of ChipDongLa enhances process capability; the silicon‑photonic and MEMS‑OCS initiatives broaden application domains; and the expansion of EDA services secures a complete design‑to‑manufacturing pipeline.

Collectively, these actions position Sai Micro Electronics to capture a growing share of the high‑performance component market, capitalize on the accelerating demand for advanced automotive electronics and optical interconnect solutions, and maintain a resilient, end‑to‑end manufacturing ecosystem in a volatile geopolitical landscape.