JCET Group Co., Ltd. – Company Overview and Market Position
Company Profile
- Name: JCET Group Co., Ltd.
- Location: Jiangyin, China
- Industry: Semiconductors & Semiconductor Equipment
- Products: Integrated circuits, flip clips, laminates, discrete products, lead‑frame packages, and other semiconductor and equipment components.
- Applications: Mobile devices, communications, computing, consumer electronics, automotive, and other sectors.
- Website: www.cj-elec.com
- Listing: Shanghai Stock Exchange (Primary Exchange)
- IPO Date: May 19 2003
Recent Financial Snapshot (as of 2025‑10‑19)
| Metric | Value | Notes |
|---|---|---|
| Close Price | 39.59 CNY | Closing price on 2025‑10‑19 |
| 52‑Week High | 47.92 CNY | Reached on 2024‑11‑10 |
| 52‑Week Low | 28.90 CNY | Reached on 2025‑04‑08 |
| Market Capitalisation | 70 680 000 000 CNY | Current market value |
| Price‑to‑Earnings Ratio | 49.11 | Indicates valuation relative to earnings |
Industry Context
Recent market analyses for related semiconductor packaging and substrate segments suggest robust growth trajectories:
- Embedded Substrate (ETS) Market: Valued at USD 1.242 billion in 2024, projected to reach USD 2.18 billion by 2031. Segments include Embedded Passive Substrate, Embedded Trace Substrate, and Embedded Die Substrate, with applications spanning automotive, communications, medical, PC/server, and smart mobile devices.
- Fan‑Out Wafer‑Level Packaging (FOWLP) Market: Estimated at USD 6.98 billion by 2031, driven by high‑density and core fan‑out packages across imaging, wireless connectivity, logic, memory, MEMS, sensors, analog, and hybrid integrated circuits.
These developments underscore a broader industry shift toward advanced packaging technologies that enhance device performance and reduce form factors—areas where JCET Group’s manufacturing capabilities can play a pivotal role.
Strategic Positioning
JCET Group’s product portfolio aligns with the growing demand for sophisticated semiconductor components across multiple verticals. The company’s presence in mobile, communication, computing, consumer, and automotive markets positions it to benefit from the expanding application base for embedded substrates and wafer‑level packaging solutions highlighted in recent market reports.
The information above is compiled solely from the supplied company fundamentals and contemporary market analyses. No additional external data has been incorporated.
