Market Overview

The Shanghai Stock Exchange and Shenzhen exchanges opened lower on June 24, 2026, but the day ended with a robust rally across key technology and materials indices. The Shenzhen Component Index and the ChiNext Index both advanced by more than one percent, while the CSI 500 Tech 50 Index surged 3.82 percent, reflecting renewed investor confidence in the semiconductor and AI‑hardware sectors. Market volume, however, fell by 1.56 trillion CNY compared with the previous session, indicating that gains were concentrated in a handful of high‑growth stocks.

The rally was driven largely by a surge in semiconductor, advanced‑packaging, and PCB related companies. Several names reached the daily price‑limit, including Jiangxi Lianhe (长电科技), Hengxin (华虹宏力), and Zhejiang Changsheng (汇成股份). In the same vein, companies supplying PCB substrates—such as China Giant Stone (中国巨石) and Sichuan Tianqi (平安电工)—experienced sharp upward momentum, reflecting the growing demand for high‑performance electronic boards in AI and computing hardware.

Sector‑Specific Drivers

Semiconductor and Advanced Packaging

The semiconductor landscape continues to be buoyed by strong earnings reports from global chip manufacturers and domestic expansion plans. For instance, Micron Technology reported earnings that exceeded expectations, and the Chinese market saw a wave of capacity expansion projects. This upward trend in chip demand has a direct ripple effect on upstream suppliers of raw materials and substrates, as chipmakers look to improve yield and reduce production costs.

PCB and CPO Concepts

The Printed Circuit Board (PCB) and Composite Printed Circuit (CPO) sectors experienced a significant rebound on June 24. This resurgence is tied to supply‑chain tightening in the raw‑material segment—specifically, the limited availability of copper foil and electronic fabric—alongside pricing pressures that have driven manufacturers to seek alternative suppliers. The Chinese market responded with a wave of share price gains across several PCB‑related firms, signalling that investors are looking for the next wave of growth in this critical component of electronic manufacturing.

AI Hardware

The AI hardware boom has extended beyond processor chips to ancillary components that enable high‑performance computing. Innovations in liquid cooling, diamond‑based heat dissipation, and glass substrates have opened new revenue streams for manufacturers of advanced materials. Companies producing these materials are poised to benefit as AI‑driven data centers and high‑performance computing clusters expand worldwide.

Implications for China Jushi Co., Ltd.

China Jushi Co., Ltd. operates in the construction materials sector but also manufactures advanced materials such as glass fibers and composite products. These materials find applications in the PCB and semiconductor manufacturing supply chain—particularly in high‑temperature environments and where mechanical strength is critical. The recent surge in demand for advanced PCBs and the broader AI‑hardware expansion suggest a favorable backdrop for suppliers of high‑quality glass fibers and composites.

Although China Jushi’s trading data for the day in question is not available, the company’s market capitalization of 232 billion CNY and its position as a provider of specialized materials position it to capture some of the upside in the semiconductor‑related materials market. The company’s ability to supply to international markets—including the United States, Canada, and several European and Asian economies—further enhances its potential to capitalize on global demand for advanced electronic components.

Market Sentiment and Risk Factors

While the technology and materials sectors have displayed resilience, there remain several risk factors:

  • Liquidity Constraints: The overall market volume fell by 1.56 trillion CNY, suggesting that the rally may be driven by a limited pool of liquid capital.
  • Regulatory Uncertainty: Several companies issued risk‑alert announcements related to PCB and other supply‑chain issues, reflecting heightened sensitivity to regulatory scrutiny and market rumors.
  • Sector‑Specific Volatility: Over 4,400 individual stocks fell during the day, indicating that the broader market experienced selective selling pressure despite the gains in key sectors.

Conclusion

The June 24, 2026 market session underscored the structural recovery of the semiconductor and AI‑hardware ecosystem, with notable strength in the PCB and advanced‑packaging segments. For material suppliers such as China Jushi Co., Ltd., the growing demand for high‑performance glass fibers and composites offers a tangible opportunity, especially as global manufacturing shifts towards more sophisticated and efficient electronic solutions. Investors will likely continue to monitor the interplay between semiconductor demand, raw‑material pricing, and supply‑chain dynamics to gauge the trajectory of companies positioned at the intersection of these evolving trends.